Wafer Placing Unit

Semiautomated placing unit setup with micron accuracy that works with 6" and 8" wafers. The wafer is placed manually into its related carrier and then pressed against its mold to be formed. The machine is capable of uv-curing and has contactless wedge compensation.

The same machine can be used for LENS REPLICATION process and WAFER STACKING process.  Features :

  • CONTACT-LESS WEDGE COMPENSATION

      ·         Vision based wedge compensation method for safe and accurate device processing
      ·         Detection accuracy of approximately 1% of depth of field
      .       Tripod positioning accuracy of ±0.5 µm on the z-axis and ±3.5 µrad on α and β-Axis-Axis
      ·         Increasing yield on imprinting lithography process due to non-contact operation

     

  • PROXIMITY GAP ALIGNMENT

     

    ·         Fully automated device loading and unloading for 6”/8” Wafers
    ·         Vibration damping with pneumatic piston-gimbal isolators
    ·         Alignment for transparent and non-transparent materials
    ·         Stacking height capabilities up to 20mm
    ·         Bonding force of 240N can be supplied, this relates on the following bonding forces
    ◦          6” wafer: approx. 13kN/m2
    ◦          8” wafer: approx. 7.4kN/m2

  • UV-CURING

    ·         Spot curing option for pre-fixation of wafer and stamp for imprinting lithography process
    ·         Line curing option for full cure capabilities
    ·         Different wavelength available (965nm / 985nm)
    ·         Curing sources for IR-Curing available
     

  • GENERIC ALIGNMENT PROCEDURES

              ·         Selectable alignment procedures for flexible product adaptation